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1 of 15 semtech proprietary & confdential ts31023/223 triune products features ? wide input supply operating range ? ts31023 : 5v-16v ? TS31223 : 5v-36v ? adjustable output voltage from 1.25v to v in - v dropout ? 60ma output current capability ? enable control function applications ? set-top boxes ? automotive ? industrial ? medical ? energy harvesting systems ? wireless power high input voltage linear regulator description the ts31x23 high voltage linear regulator consists of a low power amplifer with a high voltage p-channel pass gate. the linear regulator has a wide operating range, and is ideal for systems that may have large voltage transients and require the output load to remain regulated. an analog current limit is used to limit output current and protect the regulator from external short circuits. summary specifcation ? ambient operating temperature 0c to 85c ? packaged in a 8pin dfn (2x2) typical application circuit ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
2 of 15 semtech proprietary & confdential pin-out confguration absolute maximum ratings thermal characteristics pin # pin symbol i/o/p description 1 gnd p ground 2 vout o regulated output voltage 3 n/c no connect 4 n/c no connect 5 n/c no connect 6 fb i feedback voltage 7 vin p input voltage 8 en i enable input over operating freeCair temperature range unless otherwise noted(1,2) unit vin -0.3 to 18 (ts31023) -0.3 to 40 (TS31223) v vout -0.3 to 18 (ts31023) -0.3 to 40 (TS31223) v en, fb -0.3 to 6.0 v electrostatic discharge C human body model 2 kv maximum junction temperature, tj 150 o c storage temperature range, tstg -65 to 150 o c lead temperature (soldering, 10 seconds) 260 o c note 1: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absoluteCmaximumCrated conditions for extended periods may afect device reliability. note 2: all voltage values are with respect to network ground terminal. package dfn ja ( o c/w) (see note 4) jc ( o c/w) (see note 5) 8 pin 73.1 10.7 note 4: this assumes a fr4 board only. note 5: this assumes a 1oz. copper jedec standard board with thermal vias. see exposed pad section and application note for more information. ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
3 of 15 semtech proprietary & confdential recommended operating conditions parameter min max units unregulated supply input voltage (vin) 5 16 (ts31023) 36 (TS31223) v enable input (en) 0 5 v regulated supply output voltage (vout) 1.25 vin - v dropout v operating junction temperature, t j -40 125 o c electrical characteristics (t=25 o c unless otherwise specifed) electrical characteristics, vin = 12v, t j = 25c, unless otherwise noted parameter symbol conditions min. typ. max. units input supply voltage vin ts31023 5 16 v TS31223 5 36 v output voltage vout 1.25 vin - v dropout v feedback voltage fb v in = 12v 1.10 1.20 1.30 v output bypass capacitor c out 1 2.2 4.7 uf disabled current i of(vin) en=0v, v in =12v 1 ua quiescent current i qq(vin) en=5v, i out = 0 220 ua load capability i out 60 ma dc line regulation (ts31023) v line v in = 5.5v to 16v, v out =5.0v, i out = 5ma 0.1 0.6 % dc line regulation (TS31223) v in = 5.5v to 36v, v out =5.0v, i out = 5ma 0.1 0.6 % dc load regulation (ts31023) v load v in = 12v, v out =5.0v, i out = 1ma to 60ma 0.02 0.35 % v in = 6v, vout=5.0v, i out = 1ma to 60ma 0.02 0.15 % current limit i limit v in =12v 100 ma ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
4 of 15 semtech proprietary & confdential typical performance characteristics ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
5 of 15 semtech proprietary & confdential typical performance characteristics continued ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
6 of 15 semtech proprietary & confdential package mechanical drawings (all dimensions in mm) units millimeters dimensions limits min nom max number of pins n 8 pitch e 0.50 bsc overall height a 0.80 0.90 1.00 standof a1 0.00 0.02 0.05 contact thickness a3 0.20 ref overall length d 2.00 bsc exposed pad width e2 0.75 0.90 1.00 overall width e 2.00 bsc exposed pad length d2 1.55 1.70 1.80 contact width b 0.18 0.25 0.30 contact length l 0.20 0.30 0.40 contact-to-exposed pad k 0.20 - - ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
7 of 15 semtech proprietary & confdential recommended pcb land pattern units millimeters dimensions limits min nom max contact pitch e 0.50 bsc optional center pad width w2 C C 1.70 optional center pad length t2 C C 0.90 contact pad spacing c1 C 2.00 C contact pad width (x8) x1 C C 0.35 contact pad length (x8) y1 C C 0.65 distance between pads g 0.15 C C ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
8 of 15 semtech proprietary & confdential application using a multi-layer pcb multi-layer board (cross-sectional view) jedec standard fr4 pcb cross-section: in a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. the efciency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. to maximize the efciency of this package for application on a single layer or multi-layer pcb, certain guidelines must be followed when laying out this part on the pcb. the following are guidelines for mounting the exposed pad ic on a multi-layer pcb with ground a plane. ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
9 of 15 semtech proprietary & confdential application using a single layer pcb the above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. each application will have diferent requirements and limitations and therefore the user should use sufcient copper to dissipate the power in the system. the output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85c. the de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. layout recommendations for a single layer pcb: utilize as much copper area for power management. in a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). in both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. important: if the attachment method is not implemented correctly, the functionality of the product is not guaranteed. power dissipation capability will be adversely afected if the device is incorrectly mounted onto the circuit board. note: not to scale ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
10 of 15 semtech proprietary & confdential profle feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 o c /second max. 3 o c /second max. preheat - temperature min (ts min ) - temperature max (ts max ) - time (ts min to ts max ) (ts) 100 o c 150 o c 60 - 120 seconds 150 o c 200 o c 60 - 180 seconds time maintained above - temperature (t l ) - time (t l ) 183 o c 60 - 150 seconds 217 o c 60 - 150 seconds peak temperature (tp) see table 4.1 see table 4.2 time within 5 o c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp-down rate 6 o c /second max. 6 o c /second max. time 25 o c to peak temperature 6 minutes max. 8 minutes max. note 1: all temperatures refer to topside of the package, measured on the package body surface. note 2: time within 5 o c of actual peak temperature (tp) specifed for the refow profles is a supplier minimum and user maximum. ir refow profle ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
11 of 15 semtech proprietary & confdential package thickness volume mm 3 < 350 volume mm 3 > 350 < 2.5mm 240 +0/-5 o c 225 +0/-5 o c > 2.5mm 225 +0/-5 o c 225 +0/-5 o c package thickness volume mm 3 < 350 volume mm 3 350 - 2000 volume mm 3 > 2000 < 1.6mm 260 o c* 260 o c* 260 o c* 1.6mm - 2.5mm 260 o c* 250 o c* 245 o c* > 2.5mm 250 o c* 245 o c* 245 o c* * tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classifed temperature at the rated msl level note 1: package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. note 2: the maximum component temperature reached during refow depends on package thickness and volume. the use of convection refow processes reduc - es the thermal gradients between packages. however, thermal gradients due to diferences in thermal mas of smd packages may still exist. note 3: components intended for use in a lead-free assembly process shall be evaluated using the lead-free peak temperature and profles defned in tables 4-1, 4.2 and 5-2 whether or not lead free. table 4-1 snpb eutectic process - package peak refow temperatures table 4-2 pb-free process - package peak refow temperatures ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
12 of 15 semtech proprietary & confdential rohs and reach compliance triune systems is fully committed to environmental quality. all triune systems materials and suppliers are fully compliant with rohs (european union directive 2011/65/eu), reach svhc chemical restrictions (ec 1907/2006), ipc-1752 level 3 materials declarations, and their subsequent amendments. triune systems maintains certifed laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: ? cadmium (cd) ? chlorofuorocarbons (cfcs) ? chlorinate hydrocarbons (chcs) ? halons ? hexavalent chromium (crvi) ? hydrobromofuorocarbons (hbfcs) ? hydrochlorofuorocarbons (hcfcs) ? lead (pb) ? mercury (hg) ? perfuorocarbons (pfcs) ? polybrominated biphenyls (pbb) ? polybrominated diphenyl ethers (pbdes) ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
13 of 15 semtech proprietary & confdential part number: ts31023-qfnr TS31223-qfnr ordering information reel dimensions (13 inch) tape width a (max) n (min) w1 w2 8mm 330 100 8.4 14.4 12mm 330 100 12.4 18.4 16mm 330 100 16.4 22.4 product specifcations ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
14 of 15 semtech proprietary & confdential all dfn and qfn packages will be oriented so that the index package locations will be on the upper right corner of the sprocket side of the carrier tape. all carrier tape used for packaging triune components will be specifcally formulated to provide protection from physical and electro-static discharge (esd) damage during shipping and storage. embossed carrier tape must be eia standard-481-1 compliant and meet the mechanical characteristics shown in table 3. dimensions are in millimeters carrier tape specifcation pkg type a0 b0 w d0 d1 e1 e2 f p1 p0 k0 t wc tc 2x2mm dfn 2.3 2.3 8.0 +/- 0.2 1.50 +/- 0.10 1.10 +/- 0.10 1.75 +/- 0.10 6.25 min 3.5 +/- 0.05 4 4 1.5 0.25 +/- 0.05 8 0.21 - 0.35 3x3mm qfn 3.3 3.3 12 1.50 +/- 0.10 1.10 +/- 0.10 3.5 +/- 0.05 8 8 1.1 4.5 0.21 - 0.35 4x4mm qfn 4.35 4.35 12 1.50 +/- 0.10 1.10 +/- 0.10 3.5 +/- 0.05 8 8 1.1 5.4 0.21 - 0.35 5x5mm qfn 5.25 5.25 12 1.50 +/- 0.10 1.10 +/- 0.10 3.5 +/- 0.05 8 8 1.1 9.2 0.21 - 0.35 6x6mm qfn 6.3 +/- 0.10 6.3 +/- 0.10 16 +/- 0.30 1.50 +/- 0.10 1.50 +/- 0.10 1.75 +/- 0.10 14.25 7.5 +/- 0.10 12 2 1.1 0.30 +/- 0.05 13.3 0.21 - 0.35 ts31023/223 final datasheet rev 1.1 march 19, 2015 www.semtech.com
15 of 15 semtech proprietary & confdential ts31023/223 final datasheet rev 1.1 march 19, 2015 contactfinformation semtechfcorporation 200fflynnfroad,fcamarillo,fcaf93012 phone:f(805)f498-2111,ffax:f(805)f498-3804 www.semtech.com importantfnotice informationfrelatingftofthisfproductfandfthefapplicationforfdesignfdescribedfhereinfisfbelievedftofbefreliable,fhoweverfsuchfinformationfisfprovidedfasfaf guidefonlyfandfsemtechfassumesfnofliabilityfforfanyferrorsfinfthisfdocument,forfforfthefapplicationforfdesignfdescribedfherein.fsemtechfreservesfthefrightf tofmakefchangesftofthefproductforfthisfdocumentfatfanyftimefwithoutfnotice.fbuyersfshouldfobtainftheflatestfrelevantfinformationfbeforefplacingfordersf andfshouldfverifyfthatfsuchfinformationfisfcurrentfandfcomplete.fsemtechfwarrantsfperformancefoffitsfproductsftofthefspecifcationsfapplicablefatftheftimef offsale,fandfallfsalesfarefmadefinfaccordancefwithfsemtechsfstandardftermsfandfconditionsfoffsale.f semtechfproductsfarefnotfdesigned,fintended,fauthorizedforfwarrantedftofbefsuitablefforfusefinflife-supportfapplications,fdevicesf orfsystems,forfinfnuclearfapplicationsfinfwhichftheffailurefcouldfbefreasonablyfexpectedftofresultfinfpersonalfinjury,flossfofflifef orfseverefpropertyforfenvironmentalfdamage.ffinclusionfoffsemtechfproductsfinfsuchfapplicationsfisfunderstoodftofbefundertakenf solelyfatfthefcustomersfownfrisk.fshouldfafcustomerfpurchaseforfusefsemtechfproductsfforfanyfsuchfunauthorizedfapplication,fthefcustomerfshallf indemnifyfandfholdfsemtechfandfitsfofcers,femployees,fsubsidiaries,fafliates,fandfdistributorsfharmlessfagainstfallfclaims,fcostsfdamagesfandfattorneyf feesfwhichfcouldfarise. thefsemtechfnamefandflogofarefregisteredftrademarksfoffthefsemtechfcorporation.ftriunefsystems,fl.l.c.fisfnowfafwholly-ownedfsubsidiaryfoffsemtechf corporation.ftheftriunefsystems?fnamefandflogo,ffmppt-lite?,fandfnanosmart?fareftrademarksfofftriunefsystems,fl.l.c.finfthefu.s.a.fallfotherftrademarksf andftradefnamesfmentionedfmayfbefmarksfandfnamesfoffsemtechforftheirfrespectivefcompanies.fsemtechfreservesfthefrightftofmakefchangesfto,forf discontinuefanyfproductsfdescribedfinfthisfdocumentfwithoutffurtherfnotice.fsemtechfmakesfnofwarranty,frepresentationforfguarantee,fexpressforf implied,fregardingfthefsuitabilityfoffitsfproductsfforfanyfparticularfpurpose.fallfrightsfreserved. ?fsemtechf2015

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